IMAC Bound Proceedings
The International Modal Analysis Conferences (IMAC) have attracted the world’s finest presenters of technical data on modal analysis. This prestigious collection of technical presentations made at IMAC may now be purchased from the Society for Experimental Mechanics, Inc.
IMAC proceedings are a worthwhile addition to technical libraries. Volumes I, II, III, IV, XIII and XIV are out of print.
Volumes V to XII are available individually or in sets.
IMAC on CD
The International Modal Analysis Conference is approaching its eighteenth conference. Take this opportunity to access all eighteen years of IMAC papers on CD. Several early years of this esteemed conference are no onger available in print. This set of three CDs allows you to search the entire history of IMAC by author, paper title or keywords of all abstracts. IMAC has presented the history and maturation of the modal analysis community. The information contained in these proceedings is a valuable asset in study and research.
Once you start your subscription, you will automatically receive an updated CD containing the most current conference on an annual basis. This will give you the software necessary to combine the current year in the search cabilities of all previous years.
Requirements: IBM-compatible PC with 16 MB RAM; Microsoft Windows 3.1, Windows 95, or Windows NT; CD-ROM drive (4x speed recommended); approx. 175MB hard disk space.
SEM Conference Proceedings are a collection of technical papers presented at SEM Conferences. By policy, each accepted speaker prepares a hard copy version of their oral presentation - most are illustrated and referenced.
Proceedings are published prior to the conference and distributed to attendees. For those individuals not able to attend, these proceedings are an excellent overview of current research and applications being conducted in the field of experimental mechanics.
Major topic areas center around testing of composites, modal analysis/dynamic systems, fracture mechanics, optical methods, including applied photoelasticity, structural testing, transducers, strain gages, residual stress, time dependent materials and electronic packaging.
2002 Winter Publication Catalog