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MEMS and Nanotechnology

Microelectromechanical systems (MEMS) and nanotechnology are revolutionary enabling technologies (ET). These technologies merge the functions of sensing, actuation, and controls with computation and communication to affect the way people and machines interact with the physical world. This is done by integrating advances in various multidisciplinary fields to produce very small devices that use very low power and operate in many different environments. Today, developments in MEMS and nanotechnology are being made at an unprecedented rate, driven by both technology and user requirements. These developments depend on micromechanical and nanomechanical analyses, and characterization of structures comprising nanophase materials.

The objective of the MEMS and Nanotechnology TD is to provide a forum for an up-to-date account of the advances in the field of MEMS and nanotechnology and to promote an alliance of governmental, industrial, and academic practitioners of ET.

Officers
Chair Gordon Shaw
NIST
gordon.shaw@nist.gov
Co-Chair

Barton Prorok
Auburn University
prorok@auburn.edu

Secretary

LaVern A. Starman

Air Force Institute of Technology

lavern.starman@afit.edu

 

Technical Division Bylaws

MEMS and Nanotechnology Technical Division-Updated May 2012

Year 2011/2012 activities for the MEMS and Nanotechnology Technical Division of the SEM

  • 21 people attended the technical division meeting in 2011
  • 2 keynote presentations on measurement of micro to nanoscale mechanical processes
  • More than 50 papers with 12 sessions
  • Continuing the symposium next year with 10 sessions
  • Two short courses have are being organized for 2012 conference on nanoindentation and MEMS fabrication
  • Continuing with Best Paper for symposium, one for regular presentation and one for a student
  • Will update the website this year, including adding bes papers
  • Two keynote speakers planned for 2012 on the subject of atom and molecule-scale mechanical testing
  • Discussion to increase student participation by obtaining funds from NSF to support student travel with a proposal
  • Discussion about merging with electronic packaging is underway

 

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