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Sensors and Instrumentation
The Sensors and Instrumentation Technical Division will promote and encourage the exchange of nonproprietary information pertaining to theory, design and application of electronic systems and components used to measure structural dynamic behavior.
| Officers |
| Chair |
Gary Foss
Boeing Commercial Airplane Group
gary.c.foss@boeing.com |
| Vice Chair |
Patrick L. Walter
Texas Christian University
Dept. of Engineering
Fort Worth, TX
p.walter@tcu.edu |
| Secretary |
Michael D. Todd
University of California, San Diego
Dept. of Structural Engineering
La Jolla, CA
mdt@ucsd.edu |
Annual Meeting
Programming Chair |
Miao Yu
University of Maryland
Department of Mechanical Engineering
College Park, MD
mmyu@eng.umd.edu |
Bylaws
Sensors and Instrumentation Division - Updated April 2009
The Sensors and Instrumentation Technical Division’s mission is to promote and encourage the exchange of nonproprietary information pertaining to theory, design and application of electronic systems and components used to measure structural dynamic behavior.
To provide an IMAC conference forum for the exchange of practical instrumentation topics, this year we organized two and a half days of tutorial sessions with 18 presentations on a variety of S&I topics. These presentations were oral only, but we’ve collected most of the slide sets and posted them at the S&I TD website (http://sem.org/TDIV-TransducersSensors.asp)
The annual S&I meeting was held at IMAC on Feb. 9 with 9 people attending. Mr Steve Arms of Microstrain Corp. gave a presentation on the company’s wireless product line, and explained some of the challenges in wireless transmission of real-time data such as synchronization and phase correction. We also discussed some of the work being done in the area of energy harvesting to power wireless sensor arrays.
We are planning to organize at least 2 days of S&I tutorial sessions for IMAC 28. We’ve discussed a possible session on wireless sensing. We’ve also discussed awarding a prize for best paper in the sensors/instrumentation category.
Some presentations from the Sensors & Instrumentation Tutorial, IMAC 27
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3-D Scanning Vibrometry for Structural Dynamic Measurements, D. E. Oliver, Polytec, Inc. |
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Guidance for Measuring Mechanical Shock and Vibration, P.L. Walter, Texas Christian University |
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Decoding an Accelerometer Specification Sheet – What Sensor Manufacturers Don’t Tell You, D. Lally, PCB Piezotronics |
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Current Status of IEEE 1451.4, M.I. Schiefer, The Modal Shop, Inc. |
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Introduction to Piezoelectric Sensors, D. Change, Dytran Instruments, Inc. |
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Strain Measurement in Hostile Environments II, V. Wnuk, HPI Hitec Products, Inc. |
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Wireless Technology Part II, A.L. Wicks, Virginia Polytechnic Institute and State University |
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Practical considerations in using IEPE accelerometers with modern data acquisition systems. |
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Advanced Wireless Architectures for Synchronizing Dynamic Measurements With GPS Technology, K. Veggeberg, National Instruments |
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Practical Considerations of Shaker Excitation Thechniques for Modal Analysis, M.A. Peres, The Modal Shop, Inc.; P. Avitabile, University of Massachusetts, Lowell |
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Advanced Signal Processing Algorithms for Sound and Vibration Beyond the FFT, K. Veggeberg, National Instruments |
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Verification of Microphones and Accelerometers, B. Kriegbaum, Brüel & Kjær Sound & Vibration Measurement A/S |
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Energy Harvesting and Synchronized Wireless Networks, S. Arms, Microstrain, Inc. |
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An Overview on The Field Balancing of Rotating Machinery, S.N. Ganeriwala, SpectraQuest |
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Effects of Aliasing and Preventing it in Test Instrumentation, C. Gibson, VTI Instruments |
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Ground Loop Problems with Measurement Systems and How
to Avoid Them, A.R. Szary, Precision Filters, Inc. |
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Modal Excitation by Dave Brown and Marco Peres |
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Accuracy, Real or Imagined by Alen Szary |
Some presentations from the Sensors & Instrumentation Tutorial, IMAC 26
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Only the Transducer Should Limit the Dynamics of the Measurement Chain, B. Kriegbaum, Bruel & Kjaer Sound & Vibration Measurement A/S |
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Fiber Optic Sensor Technology, M. Yu, University of Maryland, College Park |
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Practical Considerations for Low Noise Measurement, J.M.W. Brownjohn, University of Sheffield |
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Selection of Accelerometers for Modal Analysis, John Kubler, Kistler |
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Sensor Performance, A (hopefully) Short Primer, M.D.Todd, University of California, San Diego |
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Strain Measurement in Hostile Environments, V. Wnuk, HPI - Hitec Products, Inc. |
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Transducer Mounting and Test Setup Considerations, R.W. Bono, The Modal Shop, Inc. |
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Understanding and Interpreting Data Sheet Noise Specifications of IEPE Accelerometers, J. Aram, Endevco Corporation |
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Understanding Variable Capacitance Accelerometers, J. Aram, Endevco Corporation |
Presentations from IMAC 25

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